Job Description

Company

Qualcomm Technologies, Inc.

Location

San Diego, CA

Job Area

Engineering Group > Mechanical Engineering

General Summary

Qualcomm is seeking a Senior Mechanical Engineer to join the IOT HW design team. This role focuses on the mechanical design of a number of IOT form factor product platforms. The successful candidate will contribute to the IOT product development lifecycle, from early concept and detailed design through prototype builds, ODM collaboration, and sustaining engineering.

Key Responsibilities

• Design and develop mechanical IOT product FFA platforms supporting next‑generation IOT architectures.
• Interface with ODM/OEM partners across the IOT space to define next‑gen IOT industrial hardware applications.
• Own detailed mechanical design, including 3D CAD models, assemblies, and manufacturing drawings.
• Create, document, source, build, and sustain mechanical server assembly BOMs.
• Coordinate and source prototype and production plastic, sheet metal, die‑cast, and CNC machined mechanical assembly components (housings, heatsinks, cables, fixtures, chassis, etc.).
• Interface with vendors and manufacturing partners to ensure design for manufacturability and support timely build schedules.
• Communicate and collaborate effectively with dynamic multi‑disciplinary teams in various geographical regions.
• Develop effective thermal, structural, and tolerance analyses of mechanical assemblies.
• Work onsite minimum 5 days/week in the Qualcomm office in San Diego, CA.

Qualifications

• BSME or equivalent from accredited college (or Master’s/PhD with relevant experience).
• 3+ years of professional mechanical engineering experience.
• Proficiency with 3D CAD tools (CREO or equivalent).
• Experience designing CNC machined, sheet metal, die‑cast, injection‑molded, and plastic injection‑molded components.
• Working knowledge of mechanical documentation, tolerancing, and GD&T.
• Strong understanding of mechanical data‑center hardware design fundamentals.
• 5+ years of 3D solid modelling design tools experience (CREO, SolidWorks, or equivalent).
• 3+ years of design experience with plastic injection‑molded, die‑cast, chassis sheet metal, and CNC machined parts.
• 3+ years of experience developing mechanical constraints for PCB assemblies.
• 3+ years electro‑mechanical design experience.
• Experience using 3D thermal analysis software (FlowTherm or Icepak).
• Experience with structural analysis FEA tools.
• Experience with tolerance stack analysis of complex assemblies.
• 2+ years of data‑center chassis and rack design experience.
• Strong written and verbal communication skills.
• Top‑down solid modelling experience with 3D design databases.
• Design constraint (EMN file) transfer experience between 3D CAD and PCB electronic CAD designs.
• Test/assembly fixture design experience.
• Experience with PDM systems (Agile preferred) for BOM and project management.

EEO

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Compensation & Benefits

Pay range: $101,400 – $152,200. Additional compensation includes discretionary bonus program and RSU grants. Qualcomm offers a competitive benefits package designed to support success at work, at home, and at play.

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